Presto Engineering Provides High-Volume Wafer-Level Test for Maja Systems Wireless Data-Center Connectivity Solutions

The system is designed to solve the terabit wireless data transport problem, addressing data center, wireless, mmWave and optical transport applications.
By IOT Journal
Mar 06, 2018


Presto Engineering Inc., an outsourced operations provider to semiconductor and Internet of Things (IoT) device manufacturers, and Maja Systems, a world-leading designer of millimeter wave (mmWave) connectivity and sensing solutions, jointly announce their successful collaboration in comprehensive wafer-level ATE for the Maja AirData family of terabit connectivity and data transport solutions.

"Presto's special expertise in high-volume mmWave RF test was essential in bringing terabit connectivity to the market efficiently," said Joy Laskar, CTO and SVP of Maja Systems. "They were able to develop a solution that provides reliable testing at the speeds and costs we need, and in a time frame that let us hit our market window."

"Scalable high-volume, high-frequency RF test solutions, like this one for Maja, will be critical for the industry to achieve the billion plus annual unit volumes projected for mmWave devices by 2020," said Michel Villemain, CEO, Presto Engineering. "We have developed custom solutions that allow us to use existing ATE, that have already been proven at volumes exceeding millions of units per year and can scale to meet projected demand."

The Maja AirData family of terabit connectivity solutions, based on the MW-6022 single-chip mmWave CMOS transceiver IC and the SPL-100 compact SMT mmWave antenna, solve the terabit wireless data transport problem, addressing data center, wireless, mmWave, and optical transport applications. Visit booth 1813 at OFC 2018, taking place March 11-15 in San Diego, for more information about Presto Engineering's RF and high-speed communication device test solutions.

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