IoT News Roundup
High-speed connectivity deployed by network operators drives shipment of more than 7 million radio modules, says Cambium Networks ••• Imec, Analog Devices sign strategic research partnership to develop IoT devices ••• STMicroelectronics combines development ecosystem with Alibaba AliOS for Chinese cloud-to-node IoT platform, announces automotive processors with built-in security set to protect connected cars against cyber threats ••• ThingPark China accelerates IoT, LoRaWAN market in China with launch of ecosystem lab for developers, marketplace ••• Industrial Internet Consortium, Avnu Alliance announce liaison ••• Tech Data to distribute iDevices smart-home products.
STMicroelectronics Combines Development Ecosystem With Alibaba AliOS for Chinese Cloud-to-Node IoT Platform, Announces Automotive Processors With Built-in Security Set to Protect Connected Cars Against Cyber Threats
AliOS availability on ST's STM32 platform shortens IoT node design cycle and time-to-market for the Chinese market
STMicroelectronics (NYSE:STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced today its cooperation with Alibaba Cloud, the cloud computing arm and business unit of Alibaba Group (NYSE: BABA), to provide a complete cloud-to-node IoT solution to the market. The cooperation will allow any designer to easily create IoT nodes and gateways using ST's key semiconductor building blocks for the IoT, run Alibaba's IoT operating system AliOS on the node, and seamlessly connect with the Alibaba Cloud for faster time-to-market of large-volume IoT applications.
With the official release of AliOS, ST has made the AliOS available to run on its robust STM32 microcontroller (MCU) platform, the market's broadest Arm Cortex-M MCU portfolio and a leading choice for Chinese IoT designers. Beyond processing, designers will get access to ST's complete portfolio covering all the key building blocks for the IoT, including connectivity, security, sensors, power management, and signal conditioning. ST's modular and interoperable IoT development platform spans state-of-the-art semiconductor components, ready-to-use development boards, free software tools, and common application examples.
The ST/Alibaba collaboration assures development efficiency and access to the first Chinese IoT turnkey platform, bringing greater convenience and productivity to developers when creating IoT nodes and to integrators when connecting to the Alibaba Cloud. Customers also get a head-start on time-to-market with AliOS's pre-validation of all software components on the platform, easing security provisions and field device upgrades.
"By collaborating with Alibaba, we can provide developers in China with the STM32 platform to build IoT nodes running AliOS. This gives customers a head-start to using the combination of AliOS Node-to-Cloud complete vertical solution and the broad portfolio of ST's IoT technologies that includes sensors, processing, security, connectivity, and power," said Arnaud Julienne, Vice President, Microcontroller, Memory, and Secure MCU & IoT, Asia Pacific Region, STMicroelectronics.
"Alibaba, a rich and powerful platform for everyone to conduct business, will help different IoT market players, both large and medium/small businesses, to find their customers or vendors. Alibaba is cooperating with ST to build joint solutions from Cloud to Node, to include security in applications, and we definitely believe AliOS and ST chipsets can help customers achieve their targets in the IoT mass-market," said Ku Wei, general manager of IOT BU of Ali Cloud BG.
In addition, the company is leading the race to protect connected cars against cyber threats with its latest automotive processors that feature a dedicated, built-in security module.
Millions of connected cars are already on the road, and industry analysts predict there will be more than 250 million by 2020http://www.gartner.com/newsroom/id/2970017. Connected services supported by on-board telematics units, Wi-Fi hotspots, Bluetooth devices – and aftermarket equipment such as on-board diagnostics (OBD) dongles -- enable drivers and passengers to be safer, more productive, socially connected, and better entertained on their journeys. Unfortunately, all this connectivity builds a real surface of attack for hackers.
Automotive groups are quickly addressing security measures to support growth in valuable markets for connected services such as content streaming, location-based assistance, intelligent emergency support, and remote software updates over the air of in-car electronic control units (ECU), while preventing hackers exploiting the connections for their own ends. Experts recommend manufacturers employ a range of techniques, including establishing trust in connected devices and securing all connections, to provide multiple layers of defense throughout the vehicle's circuitry and software.
ST is helping the industry meet these challenges by combining its expertise in security chips – proven in financial and government applications worldwide -- and automotive semiconductors that meet important industry safety and quality standards. The newTelemaco3P telematics and connectivity processors (STA1385 and its variants) are the first automotive microprocessors to integrate a powerful, dedicated, isolated Hardware Security Module (HSM), which acts like an independent security guard to watch data exchanges and encrypt and authenticate messages. The HSM securely checks the authenticity of received messages and any external devices that try to connect and protects against eavesdropping.
With this HSM on-chip, Telemaco3P devices are ahead of the general-purpose application processors typically found in current connected-car systems, which lack dedicated hardware-based security. ST's new chips are also extremely robust, with a 105°C maximum temperature rating for use in locations that can become extremely hot, such as on top or directly beneath the roof in a smart antenna.
"Realizing the benefits of connected cars requires strong protection against cyber-attacks," said Antonio Radaelli, Infotainment Business Unit Director, Automotive and Discrete Product Group, STMicroelectronics. "Our new Telemaco3P processors combine ST's proven expertise in hardware security and knowledge of the automotive industry's standards and requirements to lay solid ground for safe and enjoyable connected motoring."
The new automotive processors are part of a comprehensive ST strategy to offer products with embedded security functions that include stand-alone Secure Elements (ST33) and embedded Flash microcontrollers (SPC5).
ST is providing engineering samples of the STA1385 to lead partners now and full production is scheduled for mid-2018.
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