IoT Standards Groups Emphasizes Collaboration at oneM2M Industry Day

Hewlett Packard Enterprise, InterDigital, Qualcomm, AT&T and iconectiv all took part in the conference, which was hosted by ATIS.
By IOT Journal
Jul 25, 2017

PRESS RELEASE:

Leading technology companies from around the world gathered to advance adoption of the Internet of Things (IoT) through increased industry cooperation, as the global IoT standards initiative oneM2M held its second successful Industry Day on Wednesday, July 13 in Memphis, TN.

HPE, InterDigital, Qualcomm, AT&T and iconectiv all took part in the conference that was hosted by ATIS. oneM2M's goal is to further collaboration on IoT initiatives and accelerate adoption through a standards-based approach. Representatives of industry groups Open Connectivity Foundation (OCF), Zigbee Alliance, Thread and Industrial Internet Consortium (IIC), as well as one of oneM2M's founding partners TTA, presented ways in which their initiatives complement oneM2M activity.

"IoT is about device and application proliferation and oneM2M is working to lay the foundation of an IoT data economy through an interoperable approach to both domain-specific and cross-domain IoT," said oneM2M Technical Plenary Chair Dr. Omar Elloumi of Nokia. "Interoperability is essential for the IoT to reach its full potential and this can only truly be achieved through collaboration among leading industry stakeholders."

"Nobody can do it alone. The industry and standards organisations must all work together to join the pieces of the puzzle together and our industry day highlighted that this is achievable," Elloumi added.

The event also featured demonstrations of oneM2M applications in different industries, as well as technical information on the latest requirements. Presentations on the oneM2M AppID registry managed by iconectiv, the global oneM2M certification programme run by TTA, and ATIS' open source initiative, which uses the oneM2M standard, were also given.

oneM2M's next Industry Day will take place in India on Wednesday, September 20, 2017 and interested parties can request an invitation from the Technical Plenary Chair.

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